THREEBOND 2225P

Epoxy Resin Adhesives

Picture of THREEBOND 2225P
Electronics Electronics Other Industrial Other Industrial
  • 1 KG
TDS SDS

Description

heat-curable, one-component, epoxy-compound resin. This product is a low halogen content material. The total chlorine content and total bromine content are less than 900 ppm each, and the sum of total chlorine content and total bromine content is less than 1500 ppm.

Function

  • Low outgassing
  • Heat resistance
  • Soldering Tracking resistance

Main component

  • Epoxy resin

Viscosity

  • 90 Pa･s