THREEBOND 2217P

Epoxy Resin Adhesives

Picture of THREEBOND 2217P
Electronics Electronics Other Industrial Other Industrial
  • 370 G
TDS SDS

Description

This is a type speedily cured at low temperature. There are grades with different viscosities, different colors, and with low halogen content

Function

  • Excellent thixotropic property
  • Rapid cure
  • Excellent bonding ability

Viscosity

  • 195 mPa·s

Main component

  • Epoxy resin