THREEBOND 2202P

Epoxy Resin Adhesives

Picture of THREEBOND 2202P
Electronics Electronics Other Industrial Other Industrial
  • 1 KG
TDS SDS

Description

High Adhesion,Low Out Gassing and Prevention of sagging stands out because it cures at temperatures as low as 60°C or more. It also features trigger curing ability, meaning that once it receives an initial burst of heat, it can continue to cure at a normal room temperature (25°C+)

Function

  • Curing at low temperatures
  • Low outgassing
  • Strong adhesive

Viscosity

  • 13.0 mPa·s

Main component

  • Epoxy resin